Compact and Versatile Hot Air Drying Oven with 800*800*800mm Chamber for Industrial Applications

I. Basic Equipment Information

1. Model: HRF512-07N

2. Purpose: Suitable for drying, curing, degumming and other heat treatment processes of semiconductors, electronic components and related materials, especially suitable for operation under nitrogen protective atmosphere to prevent high-temperature oxidation of materials.

3. System Composition: Using MCGS touch screen as the upper computer, Yamatake C1A and C1M temperature controllers and Siemens PLC as the lower computer to form a stable and reliable control system.

Detailed Photos

II. Main Technical Parameters

1. Operating Temperature Range: Room temperature (RT) to 650°C, covering conventional process temperature requirements.

2. Maximum Test Temperature: Up to 700°C, though prolonged operation at this temperature is not recommended. The advised operating temperature should not exceed 650°C.

3. Furnace Chamber Dimensions (Internal): 800 × 800 × 800 mm (W × H × D), suitable for medium-sized workpiece processing.

4. Number of Heating Zones: 1 zone, meaning the entire chamber serves as a uniform heating area.

5. Temperature Control Points: 1 control point for precise temperature regulation.

6. Heating Method: Utilizes stainless steel heating elements, offering high-temperature resistance, oxidation resistance, and long service life.

7. Maximum Heating Power: ≤36 kW, meeting rapid heating demands while optimizing energy efficiency.

8. Temperature Uniformity: Under 650°C conditions, after 1 hour of empty furnace stabilization, temperature uniformity is ±5°C, meeting most process requirements for consistency.

9. Insulation Material: Full-fiber construction with excellent thermal insulation, minimizing heat loss and improving efficiency.

10. Air Circulation: A centrifugal fan ensures uniform heat distribution, enhancing heating performance.

11. Temperature Control System: Features a Yokogawa controller (Japan) paired with Siemens PLC for precise, stable temperature control, suitable for continuous long-term operation.

III. Gas & Cooling System

1. Nitrogen (N₂) Supply Requirements:

   • Type: High-purity nitrogen (N₂)

   • Purity: ≥99.999% (5N grade)

   • Inlet Pressure: 0.2-0.4 MPa

   • Flow Rate: ~10 m³/h

   • Purpose: Provides inert atmosphere to prevent oxidation, ideal for sensitive processes like binder burnout and sintering.

2. Cooling Method: Natural furnace cooling; no active forced cooling (e.g., water/air cooling) is integrated. Post-operation cooling requires planned downtime.

3. Water Supply (If Water-Cooled Components Are Installed):

   • Quality: Clean, non-corrosive

   • Temperature: ≤23°C

   • Pressure: 0.2-0.4 MPa

   • Flow Rate: ~2-6 L/min

   • Note: Not all units include water cooling; verify based on actual configuration.

4. Exhaust System: Requires connection to an external extraction system (non-contact), with capacity >15 m³/h to evacuate furnace exhaust/nitrogen, ensuring operational safety.

IV. Power & Electrical Requirements

1. Power Supply: 3-phase, 5-wire system; voltage 220/380 V, 50 Hz.

2. Power Capacity: Total demand >50 kVA; recommend surplus capacity for stable supply.

3. Wiring Color Codes:

   • Phase Lines (L1/L2/L3): Yellow, green, red

   • Neutral (N): Blue

   • Ground (PE): Yellow-green

4. Power Quality: Industrial-grade stability with minimal voltage fluctuations to avoid disruptions affecting performance.

V. Installation Environment & Site Requirements

1. Ambient Temperature: 0-40°C; deviations may impact performance.

2. Humidity: <80% RH, no condensation to protect electrical components.

3. Atmosphere: Free of corrosive, flammable, or explosive substances, and strong acid/alkali vapors.

4. Airflow: Minimal drafts or vibrations to maintain stability.

5. Floor Specifications:

   • Level, sturdy, vibration-resistant

   • Load-bearing capacity >300 kg/m²

6. Recommended Site Dimensions: 2000 × 3000 × 3000 mm (W × D × H); minimum area >6 m².

7. Space Requirements: Sufficient clearance for door operation, workflow, and maintenance access.

VI. Control System Features

1. HMI: MCGS touchscreen with intuitive interface for temperature display, parameter setting, status monitoring, and alarms.

2. Controllers:

   • Temperature: Yokogawa C1A/C1M modules (Japan) for precision

   • Logic: Siemens PLC for automation and safety

3. Data Acquisition & Control:

   • Real-time temperature signal processing

   • Stable communication between HMI and modules

   • High reliability for continuous industrial operation