controlled atmosphere heat treatment furnace ساخت آنلاین

1. Applications: Mainly used for binder burning out(BBO) process of electronic components , ceramic substrates. Detailed Photos Product Parameters 2. Ma inly Specifics: Rated Temp. 350 ºC Max Temp. 500 ºC ... ادامه مطلب

Company Profile Hefei Chitherm Equipment Co., Ltd. is an advanced equipment supplier specializing in the research and development, design, manufacturing, sales, maintenance, and service of high-, medium-, and ... ادامه مطلب

1650°C Melting Furnace Bf220-17nh High-Temperature Atmosphere Bell Furnace Product Specifications Attribute Value Usage Drying Fuel Electric Atmosphere H2/N2 Effective Chamber Dimensions Φ750*500 Warranty 1 ... ادامه مطلب

High Temperature Box Furnace for Industrial 1650-1700°C U-Shaped Silicon Molybdenum Rod Heating Air/Oxygen Atmosphere Core Parameters Model HBF52-17O High-Temperature Box Furnace Dimensions 1130×1945×1149 mm (W... ادامه مطلب

Company Profile Product Description 1. Applications: Mainly used for High Temperature Co-fired Ceramic (HTCC) in high temperature nitrogen and hydrogen atmosphere co-firing process, and also can be used for ... ادامه مطلب

The HRF216-07N debinding furnace is a hot air circulation box furnace specially designed for degreasing and binder removal of electronic ceramics. It is suitable for debinding processes of various precision ... ادامه مطلب

SUS310S Vertical Muffle Furnace Electric Vacuum Nitrogen Hydrogen Atmosphere Product Attributes Attribute Value Range of Applications Industrial Type Electric Holding Furnace Usage Ceramic Sintering Fuel ... ادامه مطلب

High Temperature Box Furnace for Precise Temperature Control and Uniform Heating Performance in Industrial Applications Main Technical Parameters Item Parameter Model HBF52-17O High-Temperature Box Furnace ... ادامه مطلب

High Temperature Resistance Atmosphere Box Furnace with Precision Control Heating Elements Key Specifications Attribute Value Setter Plate Corundum-Mullite Transport Package Wooden Package Supply Ability 50 ... ادامه مطلب

1. Applications: Mainly used for binder burning out(BBO) process of electronic components , ceramic substrates. Detailed Photos Product Parameters 2. Ma inly Specifics: Rated Temp.: 350 ºC Max Temp.: 500 ºC ... ادامه مطلب