HRF216-07N Hot Air Drying Oven 600x600x600mm 700ºC Max

I. The HRF216-07N hot air debinding furnace is a high-end thermal processing equipment featuring compact structure, comprehensive functions, and intelligent control. It is particularly suitable for production processes with stringent requirements for temperature uniformity, temperature control accuracy, and process safety.

Model: HRF216-07N

Application: Mainly used for heat treatment processes such as drying, curing, and degreasing of semiconductors, electronic components, and related materials.

II. Main Technical Specifications

•Operating Temperature Range: Room temperature (RT) to 650°C, meeting the requirements of most debinding and curing processes; maximum test temperature up to 700°C, suitable for short-term extreme testing.

•Effective Chamber Dimensions: Internal workspace of 600 mm (width) × 600 mm (height) × 600 mm (depth), suitable for medium-sized batch workpiece processing.

•Temperature Zone: Single-zone structure, meaning the entire chamber operates as a unified heating and temperature control area with high temperature uniformity.

•Temperature Control Points: 1 control point for precise temperature regulation within the workspace.

•Programmable Segments: Supports 4×16-segment program control, enabling complex heating, holding, and cooling process curves to meet diverse process requirements.

•Heating Method: Utilizes stainless steel heating tubes for efficient and long-lasting heating, suitable for high-temperature environments.

•Airflow System: Equipped with 1 centrifugal fan wheel for forced hot air circulation, improving temperature uniformity and ensuring balanced heat distribution.

•Furnace Structure: Features a double-layer stainless steel shell and full-fiber insulation material, offering robust structural integrity and thermal insulation to minimize heat loss.

•Temperature Uniformity: Under empty furnace conditions at 300°C to 600°C with 1-hour stabilization, temperature deviation across the chamber is controlled within ±5°C, meeting most process requirements for uniformity.

•Temperature Controller: Uses an imported single-loop intelligent temperature controller from Japan, ensuring stable performance, user-friendly operation, and precise temperature regulation.

•Temperature Measurement & Control: Employs K-type thermocouples for temperature sensing, coupled with intelligent controllers for signal processing, achieving high control accuracy.

•Temperature Control Precision: PID auto-tuning ensures single-point stability within ±1°C for precise temperature management.

•Safety Features: Includes multiple protections such as high-temperature alarm and thermocouple failure alerts to ensure safe and reliable operation.

•Heating Power: Maximum heating power of 24 kW enables rapid heating to meet high-efficiency production cycles.

•Idle Holding Power: Power consumption as low as 12 kW or less during idle holding, aiding energy efficiency.

•Exhaust System: Features 1 exhaust port with manual airflow adjustment to regulate chamber atmosphere and pressure as per process needs.

•Power Supply Requirements: Operates on 380 V (±5%), three-phase five-wire, 50 Hz AC, standard industrial power.

•Wiring Recommendations (Color Coding):

•Live wires: Yellow, green, red

•Neutral wire: Blue

•Ground wire: Yellow-green

Strongly advised to have professional electricians perform wiring to ensure electrical safety.

•Recommended Power Capacity: User power system should provide at least 32 kVA to ensure stable startup and operation.

•Surface Temperature Rise: Outer shell temperature rise controlled to ≤35°C during operation, ensuring safety and preventing burns.

•Weight: Approx. 1000 kg; requires appropriate lifting equipment and manpower for handling and installation.

•Dimensions (L×W×H): 1250 mm × 1900 mm × 1500 mm (approximate external size for installation planning).

III. Intelligent Control Features

•Equipped with a smart programmable temperature controller supporting 4×16-segment program control, allowing users to set multi-stage heating rates, holding times, and cooling processes for precise process execution.

•The system monitors chamber temperature in real-time via thermocouples, transmitting signals to the controller for power module adjustment and heating output regulation.

•Built-in PID auto-tuning optimizes control parameters based on furnace conditions, ensuring stable and accurate temperature control.

•High precision: Temperature fluctuation ≤±1°C under stable conditions, ideal for temperature-sensitive applications.

•Multiple safety protections, including high-temperature alarms and thermocouple failure alerts, safeguard personnel and products during operation.

IV. Pre-Installation & Usage Requirements

To ensure safe, stable, and efficient operation of the HRF216-07N hot air debinding furnace, customers must complete the following preparations:

1. Environmental Conditions

   •Ambient temperature: 0°C to 40°C.

   •Relative humidity ≤80% RH to prevent moisture damage to electrical components and furnace integrity.

   •No corrosive gases (e.g., acid/alkali vapors) to avoid equipment corrosion.

   •Avoid locations with strong airflow or vibration to maintain temperature uniformity and stability.

2. Gas Supply (Process-Dependent)

   •Clean, oil-free compressed air or high-purity nitrogen (recommended for superior protection).

   •Gas purity ≥99.999% to prevent product contamination.

   •Inlet pressure: 0.2-0.4 MPa.

   •Flow rate: ~3-7 m³/h; assess supply capacity based on actual usage.

   For oxidation prevention or special atmospheres, high-purity nitrogen is strongly advised.

3. Water Supply (If Applicable)

   •For water-cooled models: Provide clean, non-corrosive cooling water.

   •Water temperature ≤23°C for optimal cooling.

   •Pressure: 0.2-0.4 MPa.

   •Flow rate: ~2-6 L/min.

   Note: Not all HRF216-07N models require water; confirm based on configuration.

4. Ventilation System

   •Must connect to an external exhaust system (≥10 m³/h capacity) to remove heat and process gases, ensuring chamber stability and safety.

5. Floor Requirements

   •Level, sturdy, vibration-free foundation to prevent operational instability.

   •Load-bearing capacity >300 kg/m² to support total weight (~1000 kg).

6. Power Supply

   •Three-phase five-wire AC, 380 V (±5%), 50 Hz.

   •Recommended capacity ≥32 kVA for startup and running power.

   •Wiring colors:

   •Live: Yellow, green, red

   •Neutral: Blue

   •Ground: Yellow-green

   Professional electrical installation is mandatory to prevent hazards.

7. Installation Space

   •Recommended area ≥2000 mm (W) × 3000 mm (D) × 3000 mm (H) for operation, maintenance, and ventilation.

   •Minimum footprint: 6 m².

V. Typical Applications

HRF216-07N is widely used in:

•Debinding for semiconductor packaging.

•Debinding/pre-sintering of electronic ceramics (LTCC/HTCC).

•Drying/curing of electronic components.

•Thermal decomposition of organics (e.g., powder metallurgy binders/resins).

•High-precision heat treatments requiring uniform temperature control.

VI. Summary & Recommendations

The HRF216-07N is a compact, intelligent, high-performance furnace ideal for electronics/semiconductor industries demanding precision, atmosphere control, and safety.

For optimal performance and longevity, users must strictly adhere to the above environmental, power, gas, water, and space requirements. Professional installation, commissioning, and training are strongly recommended.