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Z największymi pozdrowieniami, [Chińska Akademia Nauk]
BF1500-15O Type High-Temperature Bell Furnace with Intelligent Control System The BF1500-15O High-Temperature Bell Furnace is committed to providing robust support for your high-temperature processes with its ... Czytaj więcej
Model BF216-11 Bell Furnace for Debinding and Sintering Processes of Low Temperature Co-fired Ceramics (LTCC) Model BF216-11 Bell Furnace is mainly used for debinding and sintering of Low Temperature Co-fired ... Czytaj więcej
Product Description Product Description I. Basic Equipment Information Equipment Name : Model HRF800-06NO Hot Air Debinding Furnace Application Fields : Debinding process for ceramic substrates and other ... Czytaj więcej
Product Description I. Basic Equipment Information Equipment Name / Model : HWF100-10NH Atmosphere Sintering Furnace Core Function : Mainly used for medium-temperature sintering and heat treatment of electronic ... Czytaj więcej
1100℃ Medium Temperature Atmosphere Box Furnace MBF22-11N_Intelligent PID Temperature Control Muffle Furnace Product Description The MBF22-11N medium temperature atmosphere box furnace is equipped with three ... Czytaj więcej
Manufacturer of HWF160-10NH Tank-Type Controlled Atmosphere Vacuum Furnace, Electric Heat Treatment Furnace for Powder Metallurgy Sintering and Reduction Hefei Chitherm Equipment Co., Ltd. is an advanced ... Czytaj więcej
Model HWF160-10NH Hydrogen Atmosphere Retort Furnace | Vacuum Annealing & Sintering Furnace for Magnetic Materials and Functional Ceramics For manufacturing magnetic materials, electronic ceramics, metal ... Czytaj więcej
220V High Temperature Box Furnace for Melting Heat Treatment Product Specifications Attribute Value Range of Applications Industrial Type Electric Holding Furnace Usage Ceramic Sintering Fuel Electric ... Czytaj więcej
Product Description 1. Application: This furnace is mainly designed for soldering process of metal parts and HTCC package , also can be used in other process es such as decarburization, annealing, quenching, ... Czytaj więcej
1. Applications: Mainly used for binder burning out(BBO) process of electronic components , ceramic substrates. Detailed Photos Product Parameters 2. Ma inly Specifics: Rated Temp. 350 ºC Max Temp. 500 ºC ... Czytaj więcej