Vacuum Muffle Furnace The Perfect Choice for Heat Treatment and Sintering Processes in Various Industries

Typical applications: Primarily used for drying, debinding, and curing of electronic components in vacuum or controlled atmosphere environments. Vacuum ovens are primarily designed for the low-temperature processing of electronic components under vacuum and protective atmospheres.

• Model: Vacuum Oven
• Primary Application: Designed for low-temperature processing of electronic components under vacuum or protective atmosphere
• Chamber Dimensions: 500×700×550mm (W×H×D)
• Temperature Range: Max Temperature: 250°C, Operating Temperature: RT ~ 200°C
• Heating System: Aluminum heating plates for uniform heat distribution with ceramic fiber insulation
• Temperature Control: 4-zone independent control with Yamatake NX-D15 intelligent programmable temperature control module
• Power Supply: 380/220±10%V, 3-phase 5-wire, 50Hz
• Power Consumption: Max Power: 4×1.5kW (6kW total)
• Weight: Approx. 600kg

• Electronics Manufacturing: Drying, curing, and annealing of PCBs, semiconductors, and sensitive electronic components
• Materials Processing: Low-temperature heat treatment under inert gas or vacuum conditions
• R&D & Laboratory Use: Precise thermal processing with multi-zone temperature control

• Environmental Conditions: Temperature 0~40°C, humidity ≤80% RH, no corrosive gases, no strong airflow disturbances
• Gas Supply Requirements:
  • High-purity nitrogen (process protective gas): Purity >99.999%, inlet pressure 0.1~0.2MPa
  • Dry, clean, oil-free compressed air (purge gas): Inlet pressure 0.4~0.8MPa
• Ventilation System: Non-contact connection to user's exhaust system, exhaust capacity >10m³/h
• Floor Requirements: Level surface, minimal vibration, load-bearing capacity >200kg/m²
• Power Supply: Capacity >8kVA, three-phase five-wire system, AC380V, 50Hz
• Installation Space: 2000mm×2000mm×3000mm (Depth×Width×Height), installation area >4m²